Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Mount Technology: Available
Vip Process: Yes
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Minimum Hole Diameter: 0.10 Mm
Pcba Standard: IPC-A-610E
Packing: Vacuum Packing With Carton Box
Surface Treatment: Immersion Gold
Number Of Layers: 4L-28L
Surface Finishing: HASL/OSP/ENIG
Pcb: Single,double,multilayer Pcb,custom Pcb
Final Foil External: 1.oz
Final Foil External: 1.oz
Surface Finishing: HASL/OSP/ENIG
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Finished Copper Thickness: 1oz
Silkscreen: White, Black, Yellow, Etc.
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Base Material: Aluminum Base,CUSTOM
Material: FR-4
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