electronic circuit board (365) オンラインメーカー
Key Words: High Density Interconnector
板の厚さ: 0.2mm-6.00mm (8ミリ~126ミリ)
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Bga: 10MIL
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Surface Mount Technology: Available
Vip Process: Yes
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
ガラス エポキシ: RO4730G3 0.762mm
ダイレクトリ常数: 2.55から10だ2
問い合わせを直接私たちに送ってください.