electronic circuit board (336) オンラインメーカー
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Surface Mount Technology: Available
Vip Process: Yes
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
ガラス エポキシ: RO4730G3 0.762mm
ダイレクトリ常数: 2.55から10だ2
表面マウント技術: はい
穴の大きさ: 0.2mm
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Final Foil External: 1.oz
Surface Finishing: HASL/OSP/ENIG
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